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User Guide

DS50003772B - 1

Introducon

The EV42J24A CEC173x Evaluation Board is intended as a demonstration, development and testing platform

for Real Time Platform Root of Trust applications in Data Center, Telecommunications, Networking, Industrial

and Embedded computing markets. This updated board is a replacement for the discontinued EV19K07A

development board. The new EV42J24A board has a simplied set of modiable jumpers, sockets for the SPI

Flash memory devices and an upgrade to the SF600 DediProg programming interface. The board can be used

with the 84-pin version of either the CEC1736 or the CEC1734 devices. This board features a variety of hardware

options (including a power supply, user interface, serial communications and expansion headers) that enable

rapid prototyping and development of Real Time Platform Root of Trust applications. This board can support

both 3.3V and 1.8V SPI memory chips via the on-board SPI sockets.

This evaluation board is designed to be used with Microchip’s Trust Platform Design Suite (TPDS), which has

multiple use cases to demonstrate the capabilities of the CEC173x-TFLX and CEC173x-TCSM devices.

• Four sample packs of three units each of CEC173x TrustFLEX

™

and TrustCUSTOM

™

devices (CEC1736-TFLX-

PROTO, CEC1736-TCSM-PROTO, CEC1734-TFLX-PROTO, CEC1734-TCSM-PROTO)

• CEC1736 demo sample for initial board bring up and validation. Not to be used for specic use case or

application development – Preprogrammed with the latest Soteria-G3 rmware release

• MEC1723 (emulated as Application Process) – MEC1723 Example rmware is included and upgradeable as

part of the TPDS tools

• CEC173x socket – Users have the ability to use a CEC173x-TFLX or CEC173x-TCSM to customize conguration

for various security features for their specic designs.

Figure 1. CEC173x Evaluaon Board

CEC173x Evaluaon Board User's Guide

EV42J24A

User Guide

DS50003772B - 2

Table of Contents

Introduction...........................................................................................................................................................................1

1. Features..........................................................................................................................................................................3

1.1. CEC173x Evaluation Board Block Diagram..................................................................................................... 3

1.2. Hardware Features............................................................................................................................................ 3

1.3. CEC173x Evaluation Board Layout...................................................................................................................4

2. Recommended Tools and Accessories....................................................................................................................... 6

3. Board Operation and Conguration........................................................................................................................... 7

3.1. Powering the CEC173x Evaluation Board........................................................................................................7

3.2. Jumper Options.................................................................................................................................................. 7

3.3. Updating the External SPI Flash Firmware................................................................................................... 11

3.3.1. Programming with the DediProg SF600........................................................................................ 11

3.3.2. Programming with the DediProg SF100........................................................................................ 12

3.3.3. Swapping the SPI Flash Memory Devices...................................................................................... 14

3.4. SPI0PER Filtering Capacitor.............................................................................................................................15

4. Development Kit Operation....................................................................................................................................... 19

4.1. Board Validation Check................................................................................................................................... 19

4.2. Trust Platform Design Suite (TPDS)............................................................................................................... 21

5. Document Revision History....................................................................................................................................... 23

Microchip Information....................................................................................................................................................... 24

Trademarks.................................................................................................................................................................. 24

Legal Notice..................................................................................................................................................................24

Microchip Devices Code Protection Feature............................................................................................................24